On 25th October, the Commissioning Ceremony of Qingdao Pingxin CMP polishing material R&D and production base project was held in Sino-German Ecopark in Qingdao Free Trade Zone. Gao Shanwu, deputy Secretary of the Party Working Committee of Qingdao West Coast New Area, Director of the Administrative Committee of Qingdao FTZ and Qingdao Sino-German Ecopark, and Hui Hongye, Director of Qingdao Pingxin Electronic Materials Co., Ltd., attended the event and delivered speeches.

The project is invested by Shanghai Runping Electronic Materials Co., Ltd. and the proposed investment of 100 million yuan is mainly used for the construction of semiconductor chip manufacturing CMP polishing materials and precision polishing head assembly R & D and production base project, and to provide the overall solution of CMP materials and components. It can provide CMP polishing materials for chip manufacturing and precision polishing head assembly services for nearby chain owner Enterprises, protect the security of industry chain and supply chain, and effectively promote the development of integrated circuit enterprises. At the same time it also fills the blank of CMP polishing materials and precision polishing head in Qingdao IC industry, and plays an important supporting role for the development of Qingdao IC industry chain. After the project reaches production, it is expected that the annual operating income will reach 300 million yuan and the annual tax will be about 11.35 million yuan.

Gao Shanwu said that in recent years Qingdao focuses on cultivating new quality productivity and accelerating the development of integrated circuit industry. Since its operation, Qingdao Integrated Circuit Industrial Park has given full play to its core leading role, and tightly focused on the strategic goal of “creating an important IC industry cluster highland in China”, grasping the project, promoting investment and stabilizing growth. Up to now, the industrial park has gathered 40 projects in the upstream and downstream of the industrial chain, with a total investment of 179.3 billion yuan. The settlement of Qingdao Pingxin CMP polishing material R&D and production base is an important supplement to Qingdao's integrated circuit industry chain. It will effectively meet the material supply needs of the main enterprises in the IC chain and become a strong force to stabilise the industrial chain and supply chain.

Hui Hongye said that the establishment of Qingdao Pingxin further promotes the localisation process of Runping Group in the field of CMP polishing materials and precision polishing head assembly services, and also provides strong support for the independent control of the national semiconductor industry chain. The CMP polishing material products and services of the project will be available to the IC enterprises around Qingdao and Shandong Province, provide the enterprises with the overall solution of CMP materials and parts, guarantee the security of the industrial chain and supply chain, and promote the development of IC enterprises.

Qingdao IC Industrial Park was officially inaugurated on 26th November 2022, and has successively settled many key enterprises such as Qingdao Sifang SRI Intellectual Technology Co.,Ltd., Qingdao Zhongwei Chuangxin Electronics Co.,Ltd.,Qingdao Fang Yi Technology Co.,Ltd., etc. In 2023, the industrial park was ranked 14th on the list of ‘Top 30 in China IC Park Competitiveness Ranking’, and Qingdao ranked 84th among the top 100 Cities for Semiconductor Industry Competitiveness and Shandong Province has successfully entered the national IC major productivity layout.

Shanghai Runping Electronic Materials Co., Ltd., established on December 13, 2021, is a technology-based enterprise of Jiangfeng Tongchuang Industry Group, specializing in the research and development, manufacturing and sales of CMP polishing materials for semiconductor chip manufacturing. Its main products and services include CMP Pad, Slurry, diamond dressing discs, precision polishing head components and assembly services (Head Rebuild), which are key process materials to enable semiconductor chip manufacturing. At present, a total of 105 patents have been applied for and 33 patents (7 invention patents) have been granted. The CMP polishing material products developed by the company's team have been mass-produced and applied in China's major semiconductor chip manufacturing enterprises. This breaks the monopoly of foreign enterprises and ends the long-term import dependence of CMP polishing materials in China.